Fiberglass Reinforced Epoxy Materials

Teflons

• Fiberglass woven
• Std TG’s 140° - 180°C available
• Standard Rigid material
• Flame Retardent - UL94VO
• Low cost
• Industrial standard
• Thickness 0.002” - 0.500”
• UV blocking resins
• DK values 4.25—4.6
• Difunctional/ Tetrafunctional
• + High performance epoxy blends

• Low DK values
• High surface/volume resistivity
• High cost
• Virgin or glass reinforced
• Call for application

Paper Phenolic / Composites

• Lowest cost
• Flamible
• Paper reinforced
• High CTE

BT / Epoxies

• Glass reinforced PI Resin Laminates
• High TG 260°C
• Thickness from 0.003” to 0.125”
• DK values 1.2—4.4
• Bismaleimide Resin System
• - Improved board strength
• - Reduced Brittleness

• Lower CTE’s than Std. FR Epoxies
• TG 185°C
• DK values 3.9 - 4.1
• Bismaleimide/Triazine epoxy resin
• Excellent for large panel sizes
• Excellent for high layer counts
• Multithermal excursion performance
• Low moisture absorption