Production Capabilities:
- Total Capability
- Multilayer Builds
to 26+ Layers
- Quick Turn Prototypes
- Prototypes Tooled
to Production Panel
- Full DFM on Prototypes
- Complete Tooling
In-House Generated
- Small Volume – Preproduction
Volume capability
- Mid Volume Capability
- Large Volume Capability
- Standard Panel Sizes
18”x24” and 21”x24”
- Standard Materials
Inventoried In House
Circuit Types:
- Single Sided
- Double Sided
- Multi-Layer
- Rigid Flex
Dielectric Materials of Construction:
- FR4: 140C Tg
Standard; 170C, 180C Tg optional
- Polyimide: 260C
Tg
- BT / Epoxy: 185C
Tg
- Teflons / Glass Reinforced
Teflons
- Getek Dk Values: 3.05-4.25
@ 1.0 GHz available
Conductive Materials:
- Base Copper Thickness
From 0.25oz through
8oz.
- Standard Base Coppers ½,
1 and 2 Ounce.
- Copper Plated to
a Max of 4 Additional
Ounces
- Button / Rivet or
Barrel only Plating
Available
- Micro BGA / Fine
Pitch / Fine Line Capable
Through Hole:
- Aspect Ratios Over
12:1
- Via holes to 0.004” Diameter
- Board Thickness 0.001” through
0.300”
- Slots / Plated Slots
- Plated Through Hole
/ Non Plated Through
Hole
- Edge Plating
- Through Plated Half
Hole
- No Maximum Plated
Hole Diameter
Solder Mask Coatings
- LPI – Liquid
Photoimageable Ink
- PIC – Photoimageable
Covercoat
- Epoxy Screened Soldermask
- Epoxy Screened Nomenclature
Inks
- Photoimageable Screened
Nomenclature Inks
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Metallic Surface Finishes
- Soft Gold & Immersion
Silver Wire Bondable
- Finishes
- Hot Air Leveled Solder
- Immersion Silver
- ENIG – Electroless
Nickel / Gold
- OSP – Organic
Solder Preservative
- Brite Tin – Electroplated
- Electroplate Nickel
and Nickel / Gold Panel Plate
- Nickel/Gold Tab
- Selective / Internal
Nickel Gold
- Silk Screened Carbon
Ink.
- Any combination of the
above
Finished Part Machining
- Finished Part Routed,
Scored and/or Punch Blanked
- Array or Individual
Part Machining Capable
- Vacuum Sealed Bubble
Packaging
Automated Optical Inspection (AOI):
- Innerlayer Circuitry
Capability
- Outerlayer Circuitry
Capability
- Phototool Verification
Electrical Test:
- 250 Volts DC to 100
Ohms
- Net List Capability
- Golden Board Capability
- Dual Side Access Stiff
Pin Fixtured
- 4 Probe – Flying
Probe Dual Side Access Fixtureless
- Controlled Impedance: +/-10%
and +/-5%
Bare Board Cleanliness / Ionic
Contamination
- Board Cleanliness: <2.0ug/in2
Chloride Ion
- Liquid Ion Chromatographically
Verified
Digital Data Requirements and
Data Transfer:
- E-mail, FTP and
Modem Transfer Capable
- Multi line - DSL Service
- All Data Types Accepted
- Gerber Data Format
Preferred
- Negative Data Power/Ground
Plane Data Preferred
- Appperatures > 0.010” Preferred
- Complete In-House
Tool Generation
- In-House Laser Photo
Plotter
Quick Turn Capability:
- Single / Double Side
In As Little As 12 hours
- Multilayers In 24 Hours – All
Layer Counts
- Orders must be placed
8am – 4pm CST
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