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Rigid/Flex Circuits

 

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Made in the USA
Flex Circuits Capabilities

Quality Circuits, Inc. - Technology and Manufacturing Capability

FLEX

Technology

Standard 

Fine 

HDI

Min Spacing Trace to Trace

0.006

0.004

0.0020

Min. Spacing Trace to Pad

0.006

0.004

0.0020

Trace Width

0.006

0.004

0.0020

Finished PCB Thickness +/-

10%

7%

5%

Dimensions - Hole Location

(+/- .003)

(+/- .002)

(+/- .0015)

Dimensions - Fab O.D.

(+/- .005)

(+/- .004)

(+/- .003)

Copper To Board Edge

0.02

0.005

<.005

Standard Via Drilled Hole Sizes

Standard 

Fine 

HDI

As Defined

0.012

0.006

< 0.006

Outer Layer Pad / Hole Criteria

Standard 

Fine 

HDI

Annular Ring

0.016 pad / 0.010 hole

0.012 pad / 0.006 hole

0.008 pad / 0.004 hole

Soldermask Criteria

Standard 

Fine 

HDI

Web - LPI Mask

0.004

0.003

0.0020

LPI Colors

Amber

 

 

Legend L/W and Height >

.005 x .040

.005 x .040

.005 x .030

Clearance - LPI Mask > or =

.003 / Side

.002 / Side

.0015 / Side

Inner Layer Pad / Hole Criteria

Standard 

Fine 

HDI

Annular Ring

0.022 pad / 0.010 hole

0.016 pad / 0.006 hole

0.010 pad / 0.004 hole

Electrical Characteristics & Testing

* Controlled Impedance +/- 10% to +/- 7%

*Stiff Pin 250 Volt Max. 100 Ohm 9.5" x 14.0 " Grid

 

* Flying Probe 250 Volt Max. 100 Ohm 20" x 27" Capable

 

 

Surface Finishes

* Immersion Silver

* Tab Nickel / Gold

* Electroless Nickel / Immersion Gold

* OSP

* Deep Nickel / Gold

* Carbon Ink

 

* Hot Air Solder Level

* Soft Gold

 

 

Materials

* Polyimide

* Polyester

 

 

Software Technologies

* Gerber Data Preferred

* IGI

* FasTech

 

* E-Mail and FTP Transfer

* Lavenir

 

 

Board Cleanliness

< 2.0 micro grams Sodium Chloride

* Quarterly Ion Chromatography Testing

 

Quick Turn Capability

* 24 Hour Quick Turn

* Weekend Manufacturing Capability

 

* Standard Production in 5 days

 

 

 

HDI Technology

* Blind Via

* Burried Via

* Via Filling

 

* Sequential Lamination

* Laser Technology