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Made in the USA

Total Capabilities

Conductive Materials

Dielectric Materials of Construction

  • Multilayer Builds to 26+ Layers
  • Quick Turn Prototypes
  • Prototypes Tooled to Production Panel
  • Full DFM on Prototypes
  • Complete Tooling In-House Generated
  • Small Volume – Preproduction Volume
  • Mid Volume Capability
  • Large Volume Capability
  • Standard Panel Sizes 18”x24” and 21”x24”
  • Standard Materials Inventoried In House
  • Base Copper Thickness From 0.25oz through 8oz.
  • Standard Base Coppers ½, 1 and 2 Ounce.
  • Copper Plated to a Max of 4 Additional Ounces
  • Button / Rivet or Barrel only Plating Available
  • Micro BGA / Fine Pitch / Fine Line Capable
  • FR4: 140C Tg Standard; 170C, 180C Tg

Optional:

  • Polyimide: 260C Tg
  • BT / Epoxy: 185C Tg
  • Teflons / Glass Reinforced Teflons
  • Getek
  • Dk Values: 3.05-4.25 @ 1.0 GHz available

Through Hole

Solder Mask Coatings

Finishes

  • Aspect Ratios Over 12:1
  • Via holes to 0.004” Diameter
  • Board Thickness 0.001” through 0.300”
  • Slots / Plated Slots
  • Plated Through Hole / Non Plated Through Hole
  • Edge Plating
  • Through Plated Half Hole
  • No Maximum Plated Hole Diameter
  • LPI – Liquid Photoimageable Ink
  • PIC – Photoimageable Covercoat
  • Epoxy Screened Soldermask
  • Epoxy Screened Nomenclature Inks
  • Photoimageable Screened Nomenclature Inks
  • Soft Gold & Immersion Silver Wire Bondable 
  • Hot Air Leveled Solder
  • Immersion Silver
  • ENIG – Electroless Nickel / Gold
  • OSP – Organic Solder Preservative
  • Brite Tin – Electroplated
  • Electroplate Nickel and Nickel / Gold Panel Plate
  • Nickel/Gold Tab
  • Selective / Internal Nickel Gold
  • Silk Screened Carbon Ink.
  • Any combination of the above

Data Requirements and Data Transfer

Circuit Types

Automated Optical Inspection (AOI):

  • E-mail, FTP and Modem Transfer Capable
  • Multi line - DSL Service
  • All Data Types Accepted
  • Gerber Data Format Preferred
  • Negative Data Power/Ground Plane Data Preferred
  • Appperatures > 0.010” Preferred
  • Complete In-House Tool Generation
  • In-House Laser Photo Plotter
  • Single Sided
  • Double Sided
  • Multi-Layer
  • Rigid Flex

 

  • Innerlayer Circuitry Capability
  • Outerlayer Circuitry Capability
  • Phototool Verification

Finished Part Machining

Automatic Optical Inspection

Elecrical Test:

  • Finished Part Routed, Scored and/or Punch Blanked
  • Array or Individual Part Machining Capable
  • Vacuum Sealed Bubble Packaging
  • Innerlayer Circuitry Capability
  • Outerlayer Circuitry Capability
  • Phototool Verification
  • 250 Volts DC to 100 Ohms
  • Net List Capability
  • Golden Board Capability
  • Dual Side Access Stiff Pin Fixtured
  • 4 Probe – Flying Probe Dual Side Access Fixtureless
  • Controlled Impedance: +/-10% and +/-5%

Quick Turn Capability

Bare Board Cleanliness / Ionic Contamination

 
  • Single / Double Side In As Little As 12 hours
  • Multilayers In 24 Hours – All Layer Counts
  • Orders must be placed 8am – 4pm CST
  • Board Cleanliness: <2.0ug/in2 Chloride Ion
  • Liquid Ion Chromatographically Verified