Production Capabilities
- Quick Turns & Proto
Types Tooled to
- Production Panel
- Full D.F.M. on Proto-Type
- Quick Turn, Proto-Type
to 24 Hours
- Small Volume - Preproduction
- Mid Volume
- High Volume
- Standard Panel Size
18"x24"
- Standard Materials
Inventoried in House.
Dielectric Materials of Construction:
- Polyimide / Kapton
- PI
- Acrylic Adhesives
- Adhesiveless
- Epoxy Adhesive
- Flame Retardant available
- Polyester with Acrylic
Adhesive - PET
- Cast Polyimide 1
mil thickness -
Adhesiveless - PI
- Polyethylene Napthalate
- PEN
Applied Rigidizeding Stiffners:
- Adhesives
- Pressure Sensitive
- PSA
- Thermal Cure Acylic
- Stiffner Materials
- FR4
- Polyimide Film
- Glass Reinforced
Polyimide
- GETEK
- BT
- Metallic
- Heat Sinks
Data Requirements and Data
Transfer:
- Design :"Flexizing" Software
In-House
- Full Tooling Generation
In-House
- Gerber Data - Preferred
- E-Mail, FTP, Modem
Transfer Capable
- Negative Data Power/Ground
Planes Preferred
- Apperatures > .010" Preferred
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Circuit Types:
- Single Sided
- Double Sided
- Multi-Layer
- Rigidized Flex
- Rigid Flex
Cover-Coatings:
- L.P.I. Liquid Photoimageable/Soldermask
- P.I.C. Photoimageable
Cover-Lay (Dry Film)
- Polyimide Film/Cover-Lay
- Polyester Film/Cover-Lay
Metallic Surface Finishes:
- Immersion Silver
- O.S.P., Organic Solderability
Preservative
- H.A.S.L., Hot Air
Solder Level
- Hard Ni/Au, Electro-Plated
Nickel / Gold
- Immersion Gold, Chemical
Deposited Ni/Au
- Soft Gold, Wire Bondable
Automatic Optical Inspection:
- Phototool
- Inner Layer
- Outer Layer
ElecricalTesting
- Capabilities: 250
volts DC to 100 Ohms
- Dual Access
Stiff Pin Fixtured
- 4 Probe - Flying Probe
Dual Access Fixtureless
- Net
List Capability
- Golden Board
Capability
Board Cleanliness:
- Values <2.0 Micro
Grams Chloride per Square Inch
- Ion Chromatography
Verification
Finish Part Machining
- Steel Rule Die Blanking
- Rigid Die
- NC Routed
- Array or Individual
Part Machining Capable
- Vacuum Seal Bubble
Packs
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Capabilities
