Total Capabilities

Conductive Materials

Dielectric Materials of Construction

• Multilayer Builds to 26+ Layers
• Quick Turn Prototypes
• Prototypes Tooled to Production Panel
• Full DFM on Prototypes
• Complete Tooling In-House Generated
• Small Volume – Preproduction Volume
• Mid Volume Capability
• Large Volume Capability
• Standard Panel Sizes 18”x24” and 21”x24”
• Standard Materials Inventoried In House

• Base Copper Thickness From 0.25oz through 8oz.
• Standard Base Coppers ½, 1 and 2 Ounce.
• Copper Plated to a Max of 4 Additional Ounces
• Button / Rivet or Barrel only Plating Available
• Micro BGA / Fine Pitch / Fine Line Capable

• FR4: 140C Tg Standard; 170C, 180C Tg

Optional:

• Polyimide: 260C Tg
• BT / Epoxy: 185C Tg
• Teflons / Glass Reinforced Teflons
• Getek
• Dk Values: 3.05-4.25 @ 1.0 GHz available

Through Hole

Solder Mask Coatings

Finishes

• Aspect Ratios Over 12:1
• Via holes to 0.004” Diameter
• Board Thickness 0.001” through 0.300”
• Slots / Plated Slots
• Plated Through Hole / Non Plated Through Hole
• Edge Plating
• Through Plated Half Hole
• No Maximum Plated Hole Diameter

• LPI – Liquid Photoimageable Ink
• PIC – Photoimageable Covercoat
• Epoxy Screened Soldermask
• Epoxy Screened Nomenclature Inks
• Photoimageable Screened Nomenclature Inks
• Soft Gold & Immersion Silver Wire Bondable 

• Hot Air Leveled Solder
• Immersion Silver
• ENIG – Electroless Nickel / Gold
• OSP – Organic Solder Preservative
• Brite Tin – Electroplated
• Electroplate Nickel and Nickel / Gold Panel Plate
• Nickel/Gold Tab
• Selective / Internal Nickel Gold
• Silk Screened Carbon Ink.
• Any combination of the above

Data Requirements and Data Transfer

Circuit Types

Automated Optical Inspection (AOI):

• E-mail, FTP and Modem Transfer Capable
• Multi line - DSL Service
• All Data Types Accepted
• Gerber Data Format Preferred
• Negative Data Power/Ground Plane Data Preferred
• Appperatures > 0.010” Preferred
• Complete In-House Tool Generation
• In-House Laser Photo Plotter

• Single Sided
• Double Sided
• Multi-Layer
• Rigid Flex

• Innerlayer Circuitry Capability
• Outerlayer Circuitry Capability
• Phototool Verification

Finished Part Machining

Automatic Optical Inspection

Elecrical Test:

• Finished Part Routed, Scored and/or Punch Blanked
• Array or Individual Part Machining Capable
• Vacuum Sealed Bubble Packaging
  

• Innerlayer Circuitry Capability
• Outerlayer Circuitry Capability
• Phototool Verification
  

• 250 Volts DC to 100 Ohms
• Net List Capability
• Golden Board Capability
• Dual Side Access Stiff Pin Fixtured
• 4 Probe – Flying Probe Dual Side Access Fixtureless
• Controlled Impedance: +/-10% and +/-5%
  

Quick Turn Capability

Bare Board Cleanliness / Ionic Contamination

• Single / Double Side In As Little As 12 hours
• Multilayers In 24 Hours – All Layer Counts
• Orders must be placed 8am – 4pm CST

• Board Cleanliness: <2.0ug/in2 Chloride Ion
• Liquid Ion Chromatographically Verified