Production Capabilities

Dielectric Materials of Construction

Applied Rigidizeding Stiffners

• Quick Turns & Prototypes Tooled to Production Panel
• Full D.F.M. on Proto-Type
• Quick Turn, Proto-Type to 24 Hours
• Small Volume - Preproduction
• Mid Volume
• High Volume
• Standard Panel Size 18"x24"
• Standard Materials Inventoried in House
  

• Polyimide / Kapton - PI
  • Acrylic Adhesives
  • Adhesiveless
  • Epoxy Adhesive
  • Flame Retardant available
• Polyester with Acrylic Adhesive - PET
• Cast Polyimide 1 mil thickness - Adhesiveless - PI
• Polyethylene Napthalate - PEN

• Adhesives
  • Pressure Sensitive - PSA
  • Thermal Cure Acylic
• Stiffner Materials
  • FR4
  • Polyimide Film
  • Glass Reinforced Polyimide
  • GETEK
  • BT
  • Metallic
  • Heat Sinks

Data Requirements and Data Transfer

Circuit Types

Cover-Coatings

• Design :"Flexizing" Software In-House
• Full Tooling Generation In-House
• Gerber Data - Preferred
• E-Mail, FTP, Modem Transfer Capable
• Negative Data Power/Ground Planes Preferred
• Apperatures > .010" Preferred

• Single Sided
• Double Sided
• Multi-Layer
• Rigidized Flex
• Rigid Flex

• L.P.I. Liquid Photoimageable / Soldermask
• P.I.C. Photoimageable Cover-Lay (Dry Film)
• Polyimide Film/Cover-Lay
• Polyester Film/Cover-Lay
  

Metallic Surface Finishes

Automatic Optical Inspection

Elecrica.Testing

• Immersion Silver
• O.S.P., Organic Solderability Preservative
• H.A.S.L., Hot Air Solder Level
• Hard Ni/Au, Electro-Plated Nickel / Gold
• Immersion Gold, Chemical Deposited Ni/Au
• Soft Gold, Wire Bondable
  

• Phototool
• Inner Layer
• Outer Layer
  

• Capabilities: 250 volts DC to 100 Ohms
• Dual Access Stiff Pin Fixtured
• 4 Probe - Flying Probe Dual Access Fixtureless
• Net List Capability
• Golden Board Capability
  

Board Cleanliness

• Values <2.0 Micro Grams Chloride per Square Inch
• Ion Chromatography Verification