| Rigid |
Technology |
Standard |
Fine |
HDI |
Min Spacing Trace to Trace |
0.006 |
0.004 |
0.0025 |
Min. Spacing Trace to Pad |
0.006 |
0.004 |
0.0025 |
Trace Width |
0.006 |
0.004 |
0.0025 |
Finished PCB Thickness +/- |
10% |
7% |
5% |
Dimensions - Hole Location |
(+/- .003) |
(+/- .002) |
(+/- .0015) |
Dimensions - Fab O.D. |
(+/- .005) |
(+/- .004) |
(+/- .003) |
Fabrication Radius ID |
0.05 |
0.031 |
<.031 |
Copper To Board Edge |
0.007 |
0.005 |
<.005 |
Min. Copper to Score Line |
0.02 |
0.015 |
0.01 |
Standard Via Drilled Hole Sizes |
Standard |
Fine |
HDI |
Finished Hole to Inner Trace or Ground Plane |
0.012 |
0.010 |
0.008 |
FR-4 Material .062 Thick |
0.018 |
0.010 |
0.008 |
Aspect Ratios |
3.5:1 |
6.0:1 |
>6.0:1 |
Outer Layer Pad / Hole Criteria |
Standard |
Fine |
HDI |
Annular Ring |
0.020 pad / 0.010 hole |
0.014 pad / 0.006 hole |
0.010 pad / 0.004 hole |
Soldermask Criteria |
Standard |
Fine |
HDI |
SMT Web - LPI Mask |
0.004 |
0.003 |
0.002 |
LPI Colors |
Green, Black, Blue, Red, Amber, Yellow, White |
Legend L/W and Height > |
.005 x .040 |
.005 x .040 |
.005 x .030 |
Clearance - LPI Mask > or = |
.003 / Side |
.002 / Side |
.0015 / Side |
Inner Layer Pad / Hole Criteria |
Standard |
Fine |
HDI |
Annular Ring |
0.022 pad / 0.010 hole |
0.016 pad / 0.006 hole |
0.012 pad / 0.004 hole |
Electrical Characteristics & Testing |
* Controlled Impedance +/- 10% to +/- 5% |
* Stiff Pin 250 Volt Max. 100 Ohm 9.5" x 14.0 " Grid |
|
* Flying Probe 250 Volt Max. 100 Ohm 20" x 27" Capable |
|
|
Surface Finishes |
* Immersion Silver |
* Deep Nickel/Gold |
|
|
* OSP |
* Soft Gold |
|
|
* Hot Air Solder Level |
* Carbon Ink |
|
|
* Tab Nickel/Gold |
* Electroless Nickel/Immer. Gold |
|
Materials |
Type |
TG |
TD |
DK @ 1.0 Ghz |
FR-4 -02 |
140 C |
320 C. |
4.25 |
FR-4 -06 |
170 C. |
295 C. |
4.29 |
FR-4-08 |
180 C |
360 C. |
3.70 |
FR370HR |
180 C |
340 C. |
4.17 |
IS-410 |
180 C. |
350 C. |
3.90 |
G200 (BT) |
185 C |
325 C. |
3.70 |
P 95 / P96 (Polyimide) |
260 C. |
415 C. |
3.90 |
Rogers 3000 / 4000 Series |
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Software Technologies |
* Gerber Data Preferred |
* IGI |
* FasTech |
|
* E-Mail and FTP Transfer |
* Lavenir |
|
|
Board Cleanliness |
< 2.0 micro grams Sodium Chloride |
* Quarterly Ion Chromatography Testing |
|
Quick Turn Capability |
* 24 Hour Quick Turn |
* Weekend Manufacturing Capability |
|
* Standard Production in 5 days |
|
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|
HDI Technology |
* Blind Via |
* Burried Via |
* Via Filling |
|
* Sequential Lamination |
* Laser Technology |
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Capabilities
